Chemical–mechanical polish of aluminum alloy thin films: slurry chemistries and polish mechanisms-Reference-Cited by-同舟云学术

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Chemical–mechanical polish of aluminum alloy thin films: slurry chemistries and polish mechanisms

Published:2005-03 Issue:1-2 Volume:474 Page:36-43
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Wang Ying-Lang,Tseng Wei-Tsu,Chang Shih-Chieh

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. Proceedings of the 7th International VLSI Multilevel Interconnection Conference (VMIC) Santa Clara, CA;Renteln,1990

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