Author:
Achanta Ravi S.,Plawsky Joel L.,Gill William N.,Kim Yeon-Hong
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Key reliability issues for copper integration in damascene architecture
2. Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International, New York;Chen,2005
3. Reliability Physics Symposium Proceedings, 2006. 44th Annual. IEEE International, New York;Chen,2006
4. Proceedings of the International Reliability Physics Symposium;Suzumura,2006
5. The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献