Development of a process modeling for residual stress assessment of multilayer thin film structure-Reference-Cited by-同舟云学术

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Development of a process modeling for residual stress assessment of multilayer thin film structure

Published:2015-06 Issue: Volume:584 Page:146-153
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Wang H.J.,Deng H.A.,Chiang S.Y.,Su Y.F.,Chiang K.N.

Funder

Advanced Micro-system Packaging and Nano-Mechanics Research Laboratory

ITRI

National Science Council of Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Overview and applicability of residual stress estimation of film-substrate structure;Chou;Thin Solid Films,2011

2. Determining local residual stresses from high resolution wafer geometry measurements;Gong;J. Vac. Sci. Technol. B,2013

3. Internal Stresses;Buckel;J. Vac. Sci. Technol.,1969

4. Stresses and deformation processes in thin films on substrates;Doerner;Crit. Rev. Solid State Mater. Sci.,1988

5. Techniques in residual stress measurement for MEMS and their applications;Chen,2006

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