Adhesion improvement of EMC–leadframe interface using brown oxide promoters-Reference-Cited by-同舟云学术

Adhesion improvement of EMC–leadframe interface using brown oxide promoters

Published:2006-05 Issue:1-2 Volume:504 Page:397-400
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Srikanth Narasimalu,Chan Lewis,Vath Charles J.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications;Pecht,1995

2. N. Srikanth, D. Saravanaranganathan, T.H. Kuah, S.C. Ho. Investigation of Newly Modified Cr Coating for IC Molding Process, The Thirteenth International Conference on Processing and Fabrication of Advanced Materials (PFAM XIII) December 6–8, 2004, Singapore.

3. Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces

4. Cuprous‐Cupric Oxide Films on Copper

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