A kinetic analysis of residual stress evolution in polycrystalline thin films-Reference-Cited by-同舟云学术

A kinetic analysis of residual stress evolution in polycrystalline thin films

Published:2012-12 Issue: Volume:526 Page:1-14
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Chason Eric

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference71 articles.

1. Residual stress in Ni–W electrodeposits

2. Application of Ni electroplating techniques towards stress-free microelectromechanical system-based sensors and actuators

3. The tension of metallic films deposited by electrolysis

4. http://www.appliedmaterials.com/newsroom/news/, Applied materials releases industry's most advanced strain engineering technology to boost 45nm transistor speed.

5. Stresses and deformation processes in thin films on substrates

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