Author:
Wang Robin C.J.,Chang-Liao K.S.,Wang T.K.,Chang M.N.,Wang C.S.,Lin C.H.,Lee C.C.,Chiu C.C.,Wu Kenneth
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. in IEEE International Reliability Physics Symposium proceedings;Ogawa,2003
2. Dominant Factors in TDDB Degradation of Cu Interconnects
3. in IEEE International Reliability Physics Symposium proceedings;Suzumura,2006
Cited by
20 articles.
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