Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability-Reference-Cited by-同舟云学术

Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability

Published:2016-08 Issue: Volume:63 Page:201-213
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Mutch Michael J.,Pomorski Thomas,Bittel Brad C.,Cochrane Corey J.,Lenahan Patrick M.,Liu Xin,Nemanich Robert J.,Brockman Justin,French Marc,Kuhn Markus,French Benjamin,King Sean W.

Funder

Intel Corporation

Semiconductor Research Corporation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference162 articles.

1. Cramming More Components Onto Integrated Circuits

2. Moore’s crystal ball: Device physics and technology past the 15nm generation

3. Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies

4. Reliability challenges for copper interconnects

5. Materials' Impact on Interconnect Process Technology and Reliability

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