The influence of amorphous TaNx under-layer on the crystal growth of over-deposited Ta film-Reference-Cited by-同舟云学术

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The influence of amorphous TaNx under-layer on the crystal growth of over-deposited Ta film

Published:2016-03 Issue: Volume:603 Page:34-38
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Wang Wei-Lin,Chen Wei-Chun,Peng Kuo-Tzu,Kuo Hsien-Chang,Yeh Ming-Hsin,Chien Hung-Ju,Ying Tzung-Hua

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers;Lane;J. Mater. Res.,2000

2. Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2;Hübner;Thin Solid Films,2003

3. Comparative study of tantalum and tantalum nitrides (Ta2N and TaN) as a diffusion barrier for Cu metallization;Min;J. Vac. Sci. Technol. B,1996

4. Phase formation behavior and diffusion barrier property of reactively sputtered tantalum-based thin films used in semiconductor metallization;Chen;Thin Solid Films,1999

5. Texture, structure and phase transformation in sputter beta tantalum coating;Lee;Surf. Coat. Technol.,2004

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1. Annealing hardening/softening of nanocrystalline Ta films mediated by grain boundary evolution and phase transformation;Materials Science and Engineering: A;2024-03

2. Effect of tantalum and Ni Ta barriers on inter-diffusion between nickel coating and GH3535 alloy at 700 °C;Surface and Coatings Technology;2023-08

3. Phase tailoring of Ta films via buffer layer-thicknesses controlling;Scripta Materialia;2022-04

4. Influence of zirconium addition on microstructure, hardness and oxidation resistance of tantalum nitride thin films;Matéria (Rio de Janeiro);2021

5. Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers;Journal of Applied Physics;2020-11-21

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