Electromigration Cu mass flow in Cu interconnections

Author:

Hu C.-K.,Canaperi D.,Chen S.T.,Gignac L.M.,Kaldor S.,Krishnan M.,Malhotra S.G.,Liniger E.,Lloyd J.R.,Rath D.L.,Restaino D.,Rosenberg R.,Rubino J.,Seo S.-C.,Simon A.,Smith S.,Tseng W.-T.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Full copper wiring in a sub-0.25 μm CMOS ULSI technology

2. Copper Metallization for High Performance Silicon Technology

3. IEEE 42nd International Reliability Physics Symp. Proc.;Usui,2004

4. IEEE 42nd International Reliability Physics Symp. Proc.;Lin,2004

5. International Reliability Physics Symposium Proceedings Proc.;von Glasow,2003

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