Effects of thermal treatment on structures of Cu/atomic-layer-deposited TaN films/Si stacks
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Stability of tantalum nitride thin film resistors
2. Electroless Cu for VLSI
3. TiN and TaN as diffusion barriers in metallizations to silicon semiconductor devices
4. Interdiffusions in Cu/reactive‐ion‐sputtered TiN, Cu/chemical‐vapor‐deposited TiN, Cu/TaN, and TaN/Cu/TaN thin‐film structures: Low temperature diffusion analyses
5. Plasma reactive ion etching of 193 nm attenuated phase shift mask materials
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