Author:
Berfield Thomas A.,Kitey Rajesh,Kandula Soma S.
Funder
National Science Foundation
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Elastoplastic analysis of the peel test;Kim;Int. J. Solids Struct.,1988
2. Interface strength, work of adhesion and plasticity in the peel test;Wei;Int. J. Fract.,1998
3. A parametric study of the peel test;Thouless;Int. J. Adhes. Adhes.,2008
4. Measurement of copper thin film adhesion by multi-stages peel test;Omiya,2002
5. Adhesion measurement of thin metal films by scratch, peel, and pull methods;Kinbara;J. Adhes. Sci. Technol.,1993
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献