Reliability and characteristics of magnetron sputter deposited tantalum nitride for thin film resistors-Reference-Cited by-同舟云学术

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Reliability and characteristics of magnetron sputter deposited tantalum nitride for thin film resistors

Published:2018-08 Issue: Volume:660 Page:688-694
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Lee Dong-Won,Kim Yong-Nam,Cho Myung-Yeon,Ko Pil-Ju,Lee Daeseok,Koo Sang-Mo,Moon Kyoung-Sook,Oh Jong-Min

Funder

Kwangwoon University

National Research Foundation of Korea

Korea Institute of Energy Technology Evaluation and Planning

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference34 articles.

1. Embedded passive resistor: challenges and opportunities for conducting polymer;Min;Synth. Met.,2005

2. Plastic electronics and their packaging technologies;Min;Synth. Met.,2003

3. Control of electrical resistivity of TaN thin films by reactive sputtering for embedded passive resistors;Kang;Thin Solid Films,2008

4. Tantalum nitride formation by low-energy (0.5–5 keV) nitrogen implantation;Arranz;Surf. Interface Anal.,2000

5. Biomedical properties of tantalum nitride films synthesized by reactive magnetron sputtering;Leng;Thin Solid Films,2001

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3. Influence of room-temperature oxidation on stability and performance of reactively sputtered TaN thin films for high-precision sheet resistors;Surfaces and Interfaces;2024-03

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