Effects of Ca on grain boundary cohesion in Au ballbonding wire-Reference-Cited by-同舟云学术

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Effects of Ca on grain boundary cohesion in Au ballbonding wire

Published:2006-05 Issue:1-2 Volume:504 Page:346-349
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Chew Y.H.,Wong C.C.,Breach C.D.,Wulff F.,Lin T.T.,He C.B.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. N. Hosoda, M. Tanaka, T. Mori, U.S. Patent No. 4,885,135, 5 Dec. 1989.

2. D. W. Kang, U.S. Patent No. 5,993,735, 30 Nov. 1999.

3. G. Herklotz, L. Schrapler, C. Simons, J. Reuel, Y.C. Cho, U.S. Patent No. 6,242,106 B1, 5 June 2001.

4. U. Tomohiro, Tatsumi Kohei, U.S. Patent No. 6,080,492, 27 June 2000.

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4. Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire;Microelectronics Reliability;2011-12

5. Strain rate sensitivity and Hall–Petch behavior of ultrafine-grained gold wires;Thin Solid Films;2008-06

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