Samarium influence on current induced atomic displacement in Aluminium and Copper combinatorial thin film alloys-Reference-Cited by-同舟云学术

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Samarium influence on current induced atomic displacement in Aluminium and Copper combinatorial thin film alloys

Published:2020-05 Issue: Volume:702 Page:137949
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Ravandi Saeedeh,Mardare Cezarina Cela,Zenger Tobias,Eibelhuber Martin,Hassel Achim Walter,Mardare Andrei Ionut^ORCID

Funder

Austrian Federal Ministry for Digital and Economic Affairs

National Foundation for Research

Christian Doppler Laboratory for Combinatorial Oxide Chemistry

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. About a new effect in the electrolytic transfer in solid alloys;Seith;Z. Elektrochem.,1953

2. Electromigration in metals;Ho;Rep. Prog. Phys.,1989

3. Comparison of stress migration and electromigration in the fabrication of thin Al wires;Lua;Thin Solid Films,2012

4. Applications of atomic layer deposition to nanofabrication and emerging nanodevices;Kim;Thin Solid Films,2009

5. Barrier-free process for fluorinated silicon film in Cu interconnects;Cheng;Thin Solid Films,2019

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1. Effect of Combined Addition of CeLa and GdY on Microstructure and Mechanical Properties of As-Cast Al-Cu-Mn Alloys;Materials;2023-11-25

2. Chemical reaction of Al-Sm sputtered amorphous electrode for stable encapsulation-free organic electronics;Electrochimica Acta;2023-04

3. Interfacial reaction and microstructure evolution of nanoparticle-added Al/Cu welded interface under direct current treatment;Materials Today Communications;2023-03

4. Gallium-Enhanced Aluminum and Copper Electromigration Performance for Flexible Electronics;ACS Applied Materials & Interfaces;2021-01-25

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