Overcoming intrinsic weakness of ULSI metallization electromigration performances
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
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4. Reduction of Electromigration in Aluminum Films by Copper Doping
5. Electromigration in Al(Cu) two‐level structures: Effect of Cu and kinetics of damage formation
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