Author:
Ang X.F.,Zhang G.G.,Wei J.,Chen Z.,Wong C.C.
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. A review of 3-D packaging technology
2. Ultra-high-density interconnection technology of three-dimensional packaging
3. G.G. Zhang, J. Wei, Z. Chen, C.C. Wong, IEEE Trans. Comp., Packag. Manufact. Technol. in press.
4. Solid Phase Welding of Metals;Tylecote,1968
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