A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics

Author:

Okoro Chukwudi A.,Obeng Yaw S.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Wafer level 3-D ICs Process Technology;Tan,2008

2. Proc. IEEE International Electron Devices Meeting (IEDM), Washington DC, USA;Edelstein,1997

3. Improving mechanical robustness of ultralow-k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening

4. Proc. IEEE International Interconnect Technology Conference (IITC), Burlingame, CA, USA;Nitta,2008

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