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Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate

  • Published:2016-02 Issue: Volume:600 Page:90-97
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Oh Yoong,Kim Eun Jeong,Kim Yongdeok,Choi Kwangseok,Han Won Bae,Kim Hee-Soo,Yoon Chong Seung

Funder

Human Resource Development Program

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Strength evaluation of silicon die for 3D chip stacking packages using ABF as dielectric and barrier layer in through-silicon via;Wu;Microelectron. Eng.,2013

2. Novel thin copper transfer films for fine line formation on PCB substrates;Narahashi;Trans. Jpn. Inst. Electron. Packag.,2010

3. ABF-based TSV arrays with improved signal integrity on 3d ic-interpowers-equivalent models and experiments;Wang;IEEE Trans. Compon. Packag. Manuf. Technol.,2013

4. Novel approach for a non-etching adhesion promoter for the next generation of IC substrates;Brooks,2007

5. Adhesion strength of the epoxy polymer/copper interface for use in microelectronics;Siau;J. Electrochem. Soc.,2005
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