Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates-Reference-Cited by-同舟云学术

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Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates

Published:2024 Issue: Volume: Page:
ISSN:2755-3701
Container-title:RSC Applied Interfaces
language:en
Short-container-title:RSC Appl. Interfaces

Author:

Ding Shanjun¹^ORCID,Wu Xiaomeng¹,Zhang Xu¹,Gui Mengqi¹,Fang Zhidan¹,Wang Qidong¹

Affiliation:

1. Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China

Abstract

High adhesion force of chip substrates is crucial for improving chip reliability in the field of microelectronics.

Funder

Chinese Academy of Sciences

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/LF/D4LF00153B

Reference48 articles.

1. L. C.Hung , P. I.Wu , H. C.Kuo , M. F.Jhong , C. C.Wang and S. M.Wang , IEEE CPMT Sym. Jap. , 2022 , pp. 134–137

2. M.Töpper , A.Ostmann , T.Braun and K. D.Lang , Adv. Embed. Fan-Out Wafer-Level Pack. Technol. , 2019 , pp. 1–38

3. S. C.Hsieh , F. C.Chu , C. Y.Ho and C. C.Wang , 22nd Eur. Microelectro. Pack. Conf Exhib. , 2019 , pp. 1–4

4. I.Hu , J. C.Tsai , F.Cheng , S. F.Yen , M. K.Shih , D.Tarng , B.Pai and C. P.Hung , IEEE 21st Electron. Pack. Technol. Conf. , 2019 , pp. 467–471

5. D.Hironiwa , Y.Morikawa , A.Ihori and R.Kamimura , IEEE 72nd Electron. Comp. Technol. Conf. , 2022 , pp. 862–866

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