A new process design for manufacturing sapphire wafers-Reference-Cited by-同舟云学术

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A new process design for manufacturing sapphire wafers

Published:2018-07 Issue: Volume:53 Page:146-150
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Uhlmann Eckart,List Michael,Patraschkov Marcel,Trachta Gerd

Funder

German Federal Ministry for Economic Affairs and Energy

Publisher

Elsevier BV

Subject

General Engineering

Reference13 articles.

1. A case for 2-body material removal in prime LED sapphire substrate lapping and polishing;Gagliardi;J Manuf Process,2013

2. Opportunities for sapphire;Rubicon Technology,2013

3. Sapphire: could new applications trigger a new investment cycle;Yole Developpement,2012

4. Sapphire subtrates report;Yole Developpement,2013

5. LEDinside releases 2017 global sapphire and LED chip market report in 2017 after two years;LEDinside,2017

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1. Spatially Selective Ultraprecision Polishing and Cleaning by Collective Behavior of Micro Spinbots;Small Structures;2024-09-09

2. Modeling of Material Removal Rate for the Fixed-Abrasive Double-Sided Planetary Grinding of a Sapphire Substrate;Materials;2024-07-25

3. Optimisation of free-abrasive assisted lapping process with vitrified bonded diamond plates for sapphire substrates;Precision Engineering;2024-03

4. Nanomaterials and Equipment for Chemical–Mechanical Polishing of Single-Crystal Sapphire Wafers;Coatings;2023-12-14

5. Effect of the carboxyl group number of the complexing agent on polishing performance of alumina slurry in sapphire CMP;Ceramics International;2023-05

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