Ultraprecision surface flattening of porous silicon by diamond turning
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference37 articles.
1. Porosity and cutting forces: from macroscale to microscale machining correlations;Tutunea-Fatan;Proc Inst Mech Eng Part B J Eng Manuf,2011
2. Silicon-based visible light-emitting devices integrated into microelectronic circuits;Hirschman;Nature,1996
3. Dynamic etching of silicon for broadband antireflection applications;Striemer;Appl Phys Lett,2002
4. A porous silicon-based optical interferometric biosensor;Lin;Science,1997
5. Design, fabrication and characterization of porous silicon multilayer optical devices;Pérez,2007
Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Controllable diamond cutting of structured surfaces with subnanometric height features on silicon;Precision Engineering;2024-10
2. Study on the effects of the machining process on porous bronze morphology via fractal dimension and pore parameters;Precision Engineering;2024-08
3. Micro-machining of glassy polymers: effect of tool wear and process parameters on the cutting-induced shape defects;The International Journal of Advanced Manufacturing Technology;2024-03-26
4. Experimental study on electrical discharge machining of porous and pure 316L stainless steel;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2024-01-31
5. Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon;Tribology International;2023-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3