Approaches for improvement of EDM cutting performance of SiC with foil electrode

Author:

Flaño Olatz,Zhao Yonghua,Kunieda Masanori,Abe Kohzoh

Publisher

Elsevier BV

Subject

General Engineering

Reference16 articles.

1. Silicon Carbide Electronic Devices;Neudeck,2001

2. Recent advances on dielectrics technology for SiC and GaN power devices;Roccaforte;Appl Surf Sci,2014

3. Development of Silicon Carbide Semiconductor Devices for High Temperature Applications;Matus,1991

4. Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining;Ishikawa;Jpn J Appl Phys,2014

5. Fundamental study on multi-wire EDM slicing of SiC by wire electrode with track-shaped section;Kimura;Procedia CIRP,2013

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1. Study of electrical discharge machining of narrow grooves with foil tool electrode;The International Journal of Advanced Manufacturing Technology;2023-09-07

2. Electrical discharge machining of semiconductor materials: A review;Journal of Materials Research and Technology;2023-07

3. Simulation of flow-field and debris temperature analysis in micro-electrical discharge milling using slotted tools;Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture;2022-01-31

4. Review on tools and tool wear in EDM;Machining Science and Technology;2021-09-03

5. Experimental Research on Discharge Forming Cutting-Electrochemical Machining of Single-Crystal Silicon;Mathematical Problems in Engineering;2021-08-04

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