Effects of support method and mechanical property of 300mm silicon wafer on sori measurement-Reference-Cited by-同舟云学术

Effects of support method and mechanical property of 300mm silicon wafer on sori measurement

Published:2005-01 Issue:1 Volume:29 Page:19-26
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Natsu Wataru,Ito Yukihiro,Kunieda Masanori,Naoi Kaoru,Iguchi Nobuaki

Publisher

Elsevier BV

Subject

General Engineering

Reference10 articles.

1. International SEMATECH: International Technique Roadmap for Semiconductors.

2. ASTM. Standard test method for measuring sori on silicon wafers by automated noncontact scanning, F1451-92.

3. Poduje N. Eliminating gravitational effect in wafer shape measurements. In: Technology for Advanced Materials/Process Characterization, NIST/ASTM/SEMI/SEMATECH Technology Conference, Dallas, TX, February 1, 1990.

4. JIS. Methods of measurement of thickness, thickness variation and bow for silicon wafer, H0611-1994.

5. ASTM. Standard test method for measuring warp and total thickness variation on silicon wafers by noncontact scanning, F657-92.

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