Modeling and experimental analysis of surface topography generation mechanism during ultrasonic vibration-assisted grinding
Author:
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Publisher
Elsevier BV
Subject
General Engineering
Reference45 articles.
1. Influence of ultrasonic vibrations on dry grinding of soft steel;Tawakoli;Int J Mach Tool Manufact,2008
2. Ultrasonic-assisted grinding of Ti6Al4V alloy;Nik;Procedia CIRP,2012
3. A study on ultrasonic assisted creep feed grinding of nickel based superalloys;Bhaduri;Procedia CIRP,2012
4. Experimental study on ultrasonic use in dry creep-feed up-grinding of aluminum 7075 and Steel X210Cr12;Abdullah;Int J Precis Eng Manuf,2013
5. Material removal mechanisms in non-contact ultrasonic abrasive machining;Ichida;Wear,2005
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