On the effect of crystallographic orientation on ductile material removal in silicon

Author:

O’Connor Brian P.,Marsh Eric R.,Couey Jeremiah A.

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

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2. Syn C, Taylor J, Donaldson R, Shimada S. Ductile-brittle Transition of Cutting Behavior in Diamond Turning of Single Crystal Silicon. LLNL UCRL-98100, 1988.

3. Bifano T, Dow T, Scattergood R. Ductile-regime grinding of brittle materials: experimental results and development of a model. In: Proceedings of the SPIE: Advances in Fabrication and Metrology for Optics and Large Optics, 1988;966:108–15.

4. Ductile-regime machining of germanium and silicon;Blake;J Am Ceram Soc,1990

5. Blaedel K, Taylor J, Evans C. Ductile-Regime Grinding of Brittle Materials. In: Jahanmuir S, Ramulu M, Koshy P, editors. Machining of Ceramics and Composites. New York: Marcel Dekker, 1999. pp. 139–76.

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