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Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers

  • Published:2016-10 Issue: Volume:46 Page:339-348
  • ISSN:0141-6359
  • Container-title:Precision Engineering
  • language:en
  • Short-container-title:Precision Engineering

Author:

Liu Haijun,Zhu Xianglong,Kang Renke,Dong Zhigang,Chen Xiuyi

Funder

National Natural Science Foundation of China

Science Fund for Creative Research Groups of NSFC

State Key Development Program for Basic Research of China

National Science and Technology Major Project of China

Publisher

Elsevier BV

Subject

General Engineering

Reference28 articles.

1. Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation;Ohba;IEICE Electron Express,2015

2. A novel 3D IC assembly process for ultra-thin chip stacking;Lin,2014

3. Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding;Huang;Mater Sci Eng A: Struct,2008

4. Advanced wafer thinning technology and feasibility test for 3D integration;Kim;Microelectron Eng,2013

5. Wafer thinning for 3D integration;Fuentes,2013

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