Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers-Reference-Cited by-同舟云学术

Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers

Published:2021-07-07 Issue:3 Volume:9 Page:035001
ISSN:2051-672X
Container-title:Surface Topography: Metrology and Properties
language:
Short-container-title:Surf. Topogr.: Metrol. Prop.

Author:

Liu Haijun^ORCID,Zhou Jing^ORCID,Han Jiang,Tian Xiaoqing,Chen Shan,Lu Lei^ORCID

Funder

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation

Link

https://iopscience.iop.org/article/10.1088/2051-672X/ac1047/pdf

Reference33 articles.

1. Polishing pad for reducing edge roll-off while maintaining good global flatness of silicon wafer;Satake;Precis. Eng.,2020

2. Residual stress distribution in silicon wafers machined by rotational grinding;Zhou;J. Manuf. Sci. Eng.,2017

3. CC-RTSV: Cross-cellular based redundant TSV Design for 3D ICs;Ni;J. Circuits Syst. Comput.,2019

4. Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer;Inoue;J. Manuf. Processes,2020

5. Surface stress evolution in through silicon via wafer during a backside thinning process;Jiang B;IEEE Trans. Semicond. Manuf.,2019

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3. A review of subsurface damage detection methods for optical components;AIP Advances;2023-06-01

4. Iterative method for obtaining nonuniform grinding-induced residual stress distribution of silicon wafers based on global deformation;Materials Science in Semiconductor Processing;2022-11

5. Corrigendum: Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers (2021 Surf. Topogr.: Metrol. Prop. 9 035001);Surface Topography: Metrology and Properties;2021-12-01