Residual stress fluctuates periodically via the workpiece rotation phase during low frequency vibration cutting
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference31 articles.
1. A review of the chip breaking methods for continuous chips in turning;Yılmaz;J Manuf Process,2020
2. Assessment of chip-breaking characteristics using new chip-breaking index;Lee;J Mater Process Technol,2006
3. Effects of coolant pressure on chip formation while turning Ti6Al4V alloy;Palanisamy;Int J Mach Tool Manufact,2009
4. A fundamental investigation of modulated tool path turning mechanics;Copenhaver;Procedia Manuf,2017
5. On the cause of chatter vibration of main spindle of lathe (6th report);Doi;Trans Japan Soc Mech Eng,1956
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Characteristics of atomic removal and mechanism of damage formation in vibration-assisted nano cutting of copper-nickel alloy;Materials Today Communications;2024-03
2. Influence of vibration conditions on tool life in low-frequency vibration cutting of difficult-to-cut materials;Journal of Advanced Mechanical Design, Systems, and Manufacturing;2024
3. Parametric Characterization and Distribution Consistency Evaluation of Machining-Induced Residual Stresses;Journal of Manufacturing Science and Engineering;2023-01-19
4. Mechanism to suppress regenerative chatter vibration due to the effect of air-cutting and multiple regeneration during low frequency vibration cutting;Precision Engineering;2022-11
5. Innovative X-ray diffraction and micromagnetic approaches for reliable residual stress assessment in deep rolled and microfinished AISI 4140 components;Journal of Materials Research and Technology;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3