Author:
Yamada Keiji,Maeda Takahiro,Iwai Tomoaki,Sekiya Katsuhiko,Tanaka Ryutaro
Reference24 articles.
1. Semiconductor devices: physics and technology;Sze,2002
2. Controlled separation of brittle materials using a laser;Lumley;Am Ceram Soc Bull,1969
3. Breaking of transparent glass plate by irradiation of YAG laser;Kurobe;J Soc Mater Sci Jpn,1993
4. Study on cleaving mechanism of silicon wafer by laser beam irradiation;Takeda;Proc. of int. conf. on leading edge manufacturing in 21st century,2009
5. Crack extension induced by thermal stresses associated with uniform heating in a circle;Morita;Trans Jpn Soc Mech Eng Ser A,1990
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