1. The effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages;Amagai,1996
2. Investigation of stress singularity fields and stress intensity factors for interfacial delamination;Amagai,1996
3. Investigation of stress singularity fields and stress intensity factors for cracks;Amagai;Finite Element Anal. Des.,1998
4. Characterization of chip scale packaging materials;Amagai;Microelectron. Reliability,1999
5. Chip scale package solder joint reliability and material characterization;Amagai;J. Japan. Inst. Electron. Packag.,2000