Batch fabrication of micromechanical elements in GaAs–AlxGa1–xAs

Author:

Hök B.,Ovrén C.,Gustafsson E.

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

1. Silicon as a mechanical material;Petersen;Proc. IEEE,1982

2. Silicon micro-transducers;Middlehoek;J. Phys. E. Sci. Instrum.,1981

3. A batch-fabricated silicon accelerometer;Roylance;IEEE Trans. Electr. Dev., ED-25,1979

4. Micromechanical accelerometer integrated with MOS detection circuitry;Petersen;IEEE Trans. Electr. Dev. ED-29,1982

5. Miniature pressure transducers with a silicon diaphragm;Gieles;Philips tech. Rev.,1973

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1. Resonant Sensors;Sensors;2008-03-20

2. Millimeter-wave passive circuit elements based on GaAs micromachining;Journal of Micromechanics and Microengineering;2005-06-20

3. III–V semiconductor properties for high temperature electronics;Materials Science and Engineering: B;1995-01

4. Buried selectively etchable microstructures in GaAs using deep nitrogen implantation;Radiation Effects and Defects in Solids;1993-03

5. Deep implantation of nitrogen into GaAs for selective three‐dimensional microstructuring;Journal of Applied Physics;1992-10

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