Fundamental aspects of pulsating current metal electrodeposition IV: Tafel equation in the deposition of metals by a pulsating current
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference8 articles.
1. The Application of Pulsed Current Electrolysis to a Rotating‐Disk Electrode System: II . Electrochemical Kinetics
2. A study of electrochemical kinetics of copper deposition under pulsed current conditions
3. chronopotentiometry on a rotating disk electrode with periodic current inputs
4. Fundamental aspects of pulsating current metal electrodeposition I: The effect of the pulsating current on the surface roughness and the porosity of metal deposits
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2. Pulse and pulse reverse plating of copper from acid sulphate solutions;Transactions of the IMF;2010-09
3. Electrodeposition of Metal Powders with Controlled Particle Grain Size and Morphology;Modern Aspects of Electrochemistry;1993
4. Pulse plating;Materials Chemistry and Physics;1990-08
5. A Study of the Current Efficiency Decrease Accompanying Short Pulse Time for Pulse Plating;Journal of The Electrochemical Society;1989-10-01
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