On the atomic mechanisms of water-enhanced silicon wafer direct bonding
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference36 articles.
1. Wafer bonding for silicon‐on‐insulator technologies
2. Semiconductor wafer bonding: recent developments
3. Hydrophilicity of Silicon Wafers for Direct Bonding
4. Low-temperature silicon wafer bonding
5. Low temperature wafer direct bonding
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