Low-temperature silicon wafer bonding-Reference-Cited by-同舟云学术

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Low-temperature silicon wafer bonding

Published:1992-04 Issue:1-3 Volume:32 Page:340-344
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Quenzer H.J.,Benecke W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Silicon-on insulator (SOI) by bonding and etch-back;Lasky;Tech. Digest, IEEE Int. Electron Devices Meeting, Washington, DC, USA,1985

2. Field assisted glass-metal sealing;Wallis;J. Appl. Phys.,1969

3. Silicon-to-silicon anodic bonding;Hanneborg;Tech. Digest, Micromechanics Europe 1990, 2nd Workshop on Micromechanics, Berlin,1990

4. Fusing silicon wafers with low-temperature glass;Field;Sensors and Actuators,1990

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