Heterogeneous silicon light sources for datacom applications-Reference-Cited by-同舟云学术

Heterogeneous silicon light sources for datacom applications

Published:2018-08 Issue: Volume:44 Page:43-52
ISSN:1068-5200
Container-title:Optical Fiber Technology
language:en
Short-container-title:Optical Fiber Technology

Author:

Liang Di,Kurczveil Geza,Huang Xue,Zhang Chong,Srinivasan Sudharsanan,Huang Zhihong,Seyedi M. Ashkan,Norris Kate,Fiorentino Marco,Bowers John E.,Beausoleil Raymond G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Atomic and Molecular Physics, and Optics,Instrumentation,Control and Systems Engineering

Reference60 articles.

1. Optical interconnects to electronic chips;Miller;Appl. Opt.,2010

2. Device requirements for optical interconnects to silicon chips;Miller;Proc. IEEE,2009

3. CMOS photonics for high-speed interconnects;Gunn;IEEE Micro,2006

4. Silicon optical modulators;Reed;Nat. Photonics,2010

5. High-performance Ge-on-Si photodetectors;Michel;Nat. Photonics,2010

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The barriers for electron and hole injection from Si substrate into the RF magnetron-deposited In2O3 : Er films;Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering;2023-09-09

2. Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films;Modern Electronic Materials;2023-07-05

3. Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films;Modern Electronic Materials;2023-07-05

4. An Energy-Efficient and Bandwidth-Scalable DWDM Heterogeneous Silicon Photonics Integration Platform;IEEE Journal of Selected Topics in Quantum Electronics;2022-11

5. Emerging devices and packaging strategies for electronic-photonic AI accelerators: opinion;Optical Materials Express;2022-03-07