1. G. Xu, B. Guenin, M. Vogel, Extension of air cooling for high power processors, in: Proc. 9th Intersociety Conf. on Thermal Phenomena, vol. 1, 2004, pp. 186–193.
2. An advanced multichip module (MCM) for high-performance UNIX servers;Knickerbocker;IBM J. Res. Dev.,2002
3. Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72;Rainey;J. Heat Transfer,2000
4. M. Arik, A. Bar-Cohen, Ebullient cooling of integrated circuits by Novec fluids, in: Proc. of the Pacific Rim Intersociety, Electronics Packaging Conf., Kauai, HI, 18–23 July 2001.
5. Experimental investigations of spray/wall impingement;Mathews;Atomization Sprays,2003