Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets

Author:

Wei Tiwei,Oprins Herman,Fang Liang,Cherman Vladimir,Beyne Eric,Baelmans M.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference49 articles.

1. Tiwei W., 2020. “ll-in-one design integrates microfluidic cooling into electronic chips,” Nature, vol. 585(7824), pages 188-189, September.

2. Local thermal measurements of a confined array of impinging liquid jets for power electronics cooling;Maddox,2015

3. Flow and Heat Transfer for Jet Impingement Arrays with Local Extraction;Onstad,2009

4. Heat transfer by a square array of round air jets impinging perpendicular to a flat surface including the effect of spent air;Kercher;J. Eng. Power. Jan,1970

5. Jet array impingement with crossflow-correlation of streamwise resolved flow and heat transfer distributions;Florschuetz,1981

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