Spatially periodic vapor bubble activity during subcooled pool boiling on 1D aluminum alloy micro-fin arrays-Reference-Cited by-同舟云学术

Spatially periodic vapor bubble activity during subcooled pool boiling on 1D aluminum alloy micro-fin arrays

Published:2021-12 Issue: Volume:180 Page:121760
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Doran Brendon,Zhang Bin,Davani Shayan,Osafo Kojo Asiamah,Sutka Owen,Walker Abigail,Mueller Nicholas,Akwaboa Stephen,Mensah Patrick,Meng W.J.,Moore Arden L.

Funder

National Science Foundation

Louisiana Board of Regents

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference40 articles.

1. Surface engineering for phase change heat transfer: a review;Attinger;MRS Energy Sustain.,2014

2. Boiling augmentation with micro/nanostructured surfaces: current status and research outlook;Bhavnani;Nanoscale Microscale Thermophys. Eng.,2014

3. Review of boiling heat transfer enhancement on micro/nanostructured surfaces;Kim;Exp Therm. Fluid Sci.,2015

4. A critical review of pool and flow boiling heat transfer of dielectric fluids on enhanced surfaces;Leong;Appl. Therm. Eng.,2017

5. Materials, fabrication, and manufacturing of micro/nanostructured surfaces for phase-change heat transfer enhancement;McCarthy;Nanoscale Microscale Thermophys. Eng.,2014

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