Boiling Augmentation with Micro/Nanostructured Surfaces: Current Status and Research Outlook-Reference-Cited by-同舟云学术

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Boiling Augmentation with Micro/Nanostructured Surfaces: Current Status and Research Outlook

Published:2014-07-03 Issue:3 Volume:18 Page:197-222
ISSN:1556-7265
Container-title:Nanoscale and Microscale Thermophysical Engineering
language:en
Short-container-title:Nanoscale and Microscale Thermophysical Engineering

Author:

Bhavnani Sushil,Narayanan Vinod,Qu Weilin,Jensen Michael,Kandlikar Satish,Kim Jungho,Thome John

Publisher

Informa UK Limited

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

http://www.tandfonline.com/doi/pdf/10.1080/15567265.2014.923074

Reference96 articles.

1. The maximum and minimum values of the heat Q transmitted from metal to boiling water under atmospheric pressure

2. Versuche über den verdampfungsvorgang

3. Experiments on pool-boiling heat transfer

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