Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

Author:

Yang YuchiORCID,Du Jianyu,Li MotongORCID,Li Weihao,Wang Qi,Wen Bo,Zhang ChiORCID,Jin Yufeng,Wang WeiORCID

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

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