Topologically optimized manifold microchannel heat sink with extreme cooling performance for high heat flux cooling of electronics-Reference-Cited by-同舟云学术

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Topologically optimized manifold microchannel heat sink with extreme cooling performance for high heat flux cooling of electronics

Published:2024-03 Issue: Volume:241 Page:122426
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Zhou Jianhong,Lu Mingxiang,Zhao Qi,Li Qiang,Chen Xuemei^ORCID

Publisher

Elsevier BV

Reference71 articles.

1. An experimental investigation of a PCM-based heat sink enhanced with a topology-optimized tree-like structure;Ho;Energ. Conver. Manage.,2021

2. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review;He;Energy,2021

3. Fluid flow and heat transfer of liquid-liquid two phase flow in microchannels: A review;Abdollahi;Int. Commun. Heat Mass Transfer,2017

4. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices;Lee;J. Electron. Packag.,2016

5. M.d.A. Al-Nimr, Single-phase heat transfer enhancement in micro/minichannels using nanofluids: Theory and applications;Hussien;Appl. Energy,2016

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1. Performance evaluation criteria of a star-shaped cross-sectional horizontal microchannel with supercritical carbon dioxide;International Communications in Heat and Mass Transfer;2024-09

2. Additively manufactured conformal cooling channels through topology optimization;Structural and Multidisciplinary Optimization;2024-07-30

3. Optimization of Heat-Dissipation Structure of High-Power Diode Laser in Space Environments;Micromachines;2024-07-29

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