1. Embedded two-phase cooling of ultra-high flux electronics using FEEDS manifold-microchannel heat sinks;Mandel;Encycl. Two-Phase Heat Transf. Flow III JR Thome Ed World Sci. Publ. Co. Singap.,2018
2. LOOP Thermosyphon design for cooling of large area, high heat flux sources;Hartenstine,2007
3. Heat pipes: review, opportunities and challenges;Faghri;Front. Heat Pipes FHP,2014
4. A review of vapor chambers;Bulut;Heat Transf. Eng.,2019
5. A review of small heat pipes for electronics;Chen;Appl. Therm. Eng.,2016