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A Review of Vapor Chambers

Published:2018-06-18 Issue:19 Volume:40 Page:1551-1573
ISSN:0145-7632
Container-title:Heat Transfer Engineering
language:en
Short-container-title:Heat Transfer Engineering

Author:

Bulut Murat¹,Kandlikar Satish G.²,Sozbir Nedim¹³

Affiliation:

1. Turksat Satellite Communication Cable TV and Operations Joint Stock Co., Ankara, Turkey

2. Mechanical Engineering Department, Rochester Institute of Technology, Rochester, NY, USA

3. Mechanical Engineering Department, Sakarya University, Sakarya, Turkey

Publisher

Informa UK Limited

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/01457632.2018.1480868

Reference105 articles.

1. Practical design of a 1000 W/cm/sup 2/ cooling system [high power electronics]

2. Review and Advances in Heat Pipe Science and Technology

3. A REVIEW OF HEAT PIPE APPLICATION INCLUDING NEW OPPORTUNITIES

4. A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

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1. Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application;Journal of Electronic Packaging;2024-08-09

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3. Experimental Study of Composite Heat Pipe Radiator in Thermal Management of Electronic Components;Energies;2024-06-11

4. Ultrafast laser preparation of gas-liquid partitioned microgroove wicks to enhance heat transfer in ultrathin vapor chambers;International Journal of Heat and Mass Transfer;2024-06

5. High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers;Langmuir;2024-05-28

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