A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

Author:

Lu Minhua1,Mok Larry1,Bezama R. J.2

Affiliation:

1. IBM T.J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598

2. IBM Microelectronics Division, Route 52, Hopewell Junction, NY 12533

Abstract

A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80W∕cm2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. The International Technology Roadmap for Semiconductors: 2004 Update.

2. The Challenges of Electronic Cooling: Past, Current and Future;Chu;ASME J. Electron. Packag.

3. http://www.thermacore.com/pdfs/BoardLevelCooling.pdf

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