Machine learning enabled condensation heat transfer measurement-Reference-Cited by-同舟云学术

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Machine learning enabled condensation heat transfer measurement

Published:2022-09 Issue: Volume:194 Page:123016
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Khodakarami Siavash^ORCID,Fazle Rabbi Kazi^ORCID,Suh Youngjoon^ORCID,Won Yoonjin^ORCID,Miljkovic Nenad

Funder

Office of Naval Research

Air Conditioning and Refrigeration Center

Ministry of Education, Culture, Sports, Science and Technology

International Institute for Carbon-Neutral Energy Research, Kyushu University

National Science Foundation

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference78 articles.

1. Hotspot cooling with jumping-drop vapor chambers;Wiedenheft;Appl. Phys. Lett.,2017

2. Enhanced Condensation for Improved Energy Efficiency;Liu;Joule,2019

3. A review on buildings energy consumption information;Pérez-Lombard;Energy Build.,2008

4. Dropwise condensation on solid hydrophilic surfaces;Cha;Sci. Adv.,2020

5. Jumping-droplet-enhanced condensation on scalable superhydrophobic nanostructured surfaces;Miljkovic;Nano Lett.,2013

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1. Development of ANN prediction model for estimation of heat transfer utilizing rectangular-toothed v-cut twisted tape;Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering;2024-08-23

2. Wetting Behavior‐Induced Interfacial transmission of Energy and Signal: Materials, Mechanisms, and Applications;Advanced Materials;2024-07-20

3. Deep Learning Enabled Comprehensive Evaluation of Jumping-Droplet Condensation and Frosting;ACS Applied Materials & Interfaces;2024-05-01

4. Self-supervised learning of shedding droplet dynamics during steam condensation;APL Machine Learning;2024-04-10

5. Recent progress of artificial intelligence for liquid-vapor phase change heat transfer;npj Computational Materials;2024-03-30

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