1. Direct liquid cooling of high flux micro and nano electronic components;Bar-Cohen;Proc. IEEE,2006
2. High Temperature Electronics;McCluskey,1997
3. I. Sauciuc, G. Chrysler, R. Mahajan, M. Szleper, Air-cooling extension—performance limits for processor cooling applications, in: Proc. of IEEE Semiconductor Thermal Measurement and Management (Semi-Therm) Symp., San Jose, CA, 2003, pp. 74–81.
4. High performance heat sinking for VLSI;Tuckerman;IEEE Elect. Device Lett.,1981
5. Analysis of two-layered microchannel heat sink concept in electronic cooling;Vafai;Int. J. Heat Mass Transfer,1999