Influence of Water-Solid Interaction and Surface Charge on Thermal Resistance Length
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s12204-024-2750-z.pdf
Reference41 articles.
1. VAN ERP R, SOLEIMANZADEH R, NELA L, et al. Co-designing electronics with microfluidics for more sustainable cooling [J]. Nature, 2020, 585(7824): 211–216.
2. WU F, TIAN H, SHEN Y, et al. Vertical MoS2 transistors with sub-1-nm gate lengths [J]. Nature, 2022, 603(7900): 259–264.
3. MOORE A L, SHI L. Emerging challenges and materials for thermal management of electronics [J]. Materials Today, 2014, 17(4): 163–174.
4. GARIMELLA S V, FLEISCHER A S, MURTHY J Y, et al. Thermal challenges in next-generation electronic systems [J]. IEEE Transactions on Components and Packaging Technologies, 2008, 31(4): 801–815.
5. YANG W, ZHU Y X, JIA Z F, et al. Interwoven nanowire based on-chip asymmetric microsupercapacitor with high integrability, areal energy, and power density [J]. Advanced Energy Materials, 2020, 10(42): 2001873.
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