Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger-Reference-Cited by-同舟云学术

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Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger

Published:2011-12 Issue:25-26 Volume:54 Page:5504-5516
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

David Milnes P.,Miler Josef,Steinbrenner Julie E.,Yang Yizhang,Touzelbaev Maxat,Goodson Kenneth E.

Funder

Semiconductor Research Corporation

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference52 articles.

1. International Technology Roadmap for Semiconductors 2009. , 2009 (accessed 29.05.11).

2. Integrated microchannel cooling for three-dimensional electronic circuit architectures;Koo;J. Heat Transfer,2005

3. K. Bernstein et al., Interconnects in the third dimension, in: Proceedings of the 44th Annual Conference on Design Automation – DAC ’07, 2007, pp. 562–567.

4. High-performance heat sinking for VLSI;Tuckerman;IEEE Electr. Dev. Lett.,1981

5. Evaluation of single phase flow in microchannels for high heat flux chip cooling – thermohydraulic performance enhancement and fabrication technology;Kandlikar;Heat Transfer Eng.,2004

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