Thermal conductivity of hybrid nanofluids: A critical review

Author:

Sajid Muhammad UsmanORCID,Ali Hafiz Muhammad

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference105 articles.

1. Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction;Arshad;Appl. Therm. Eng.,2017

2. Experimental passive electronics cooling: Parametric investigation of pin-fin geometries and efficient phase change materials;Ashraf;Int. J. Heat Mass Transf.,2017

3. Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison;Ali;Int. J. Heat Mass Transf.,2018

4. Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter;Arshad;Int. J. Heat Mass Transf.,2018

5. S.U.S. Choi, J.A. Eastman, Enhancing thermal conductivity of fluids with nanoparticles, in: Conference: 1995 International Mechanical Engineering Congress and Exhibition, San Francisco, CA, United states, 12–17 November, ASME, San Francisco, 1995, pp. 99–105.

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