Correlations highlighting effects of the PCB’s Copper ratio on the free convective heat transfer for a tilted QFN32 electronic package-Reference-Cited by-同舟云学术

Correlations highlighting effects of the PCB’s Copper ratio on the free convective heat transfer for a tilted QFN32 electronic package

Published:2016-01 Issue: Volume:92 Page:110-119
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Baïri A.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

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